Stack up: one layer single side adhesive-less copper + two layers side
CCL: 1/2 mils PI, 1/3oz, adhesive-less, double RA copper
CCL: 1/2oz, 1 mil PI, 13um adhesive
Cover layer: 1/2 mils, 25um x 2 layers
Bonding: MS13A and BH-25
Surface treatment: immersion gold
Solder mask: N/A
Minimum trace width: 0.09mm
Minimum trace space: 0.07mm
Minimum hole diameter: 0.20mm
Conductive layer: N/A
Comes with RoHS compliant
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